Chip Assembly Die Bonding Process Engineer (m/f/d) - 100%
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Description Coherent is a global leader in photonics, developing advanced laser, optical and materials technologies that enable semiconductor manufacturing, AI infrastructure, advanced communications and precision industrial applications worldwide.
Chip Assembly Die Bonding Process Engineer Join our semiconductor manufacturing team as a Chip Assembly Process Engineer, where you will take ownership of critical chip assembly processes including die bonding, curing, marking, and inspection.
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