Package Design Engineer

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Description

The Package Innovation (PI) department is an organization within NXP's Corporate Technology Office that develops advanced semiconductor packaging solutions and next-generation packaging technologies across all NXP product lines.

The Package Design team is a centralized global function responsible for package development and package design execution across NXP.

This position primarily supports the Networking & Radar (NR) and Automotive Processing & Systems business lines developing advanced driv…

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