Principal Research Engineer, Adv Pckg, IME

Job Description We are seeking a results-oriented leader for platform technology integration in Advanced Packaging department developing system-in-package at wafer level.

The candidate will be responsible for defining the medium-to-long term process capability roadmap to support packaging platform technologies, developing 2.5D TSV interposers, and integrating optics with electronics using highly scaled u-bump and hybrid bond technologies for networking and high-performance computing interconnec…