RF/EM Design Co-Op

Description

We are seeking a master’s or Ph.D. Electrical Engineering student specializing in electromagnetics to join our Ottawa design team as an RF/EM Design Co-Op.

The student will work alongside experienced engineers developing RF front-end modules for wireless applications. This environment will provide exposure to a broad range of RF technologies, including power amplifiers, low-noise amplifiers, acoustic filters, switches, passive components, matching networks, packaging, and module-level integration. Through technical discussions, design reviews, electromagnetic simulations, and laboratory measurements, the student will gain insight into how these technologies interact within complete RF front-end solutions.

The student’s primary project will focus on characterizing RF multichip module (MCM) technologies and the components integrated within them. The student will design and tape out precise test and de-embedding structures, perform probe-based RF measurements, and extract dielectric and conductor properties, including the effects of conductor surface roughness.

Measured results will be correlated with ADS and HFSS simulations. Cross sections and other physical analyses performed using internal facilities will confirm fabricated dimensions and material characteristics, helping the student determine how these physical details should be represented in electromagnetic models. The student will also investigate characterization structures and extraction methods for surface-mount technologies.

The resulting models and characterization methods will improve RF simulation precision across the business unit. In addition to completing this focused project, the student will gain practical experience with RF front-end module technology, electromagnetic design, RF measurements, packaging, component integration, and product development.

This is a full-time, in-office co-op position in Ottawa for a continuous 12-month term. The start date is flexible between January and April 2027.

Responsibilities

• Develop in-situ methods for characterizing dielectric and conductor properties in RF MCM technologies.
• Design precise test and de-embedding structures for material and interconnect characterization.
• Create MCM layouts and support the tape-out of characterization test vehicles.
• Perform probe-based RF measurements using standard laboratory equipment.
• Extract dielectric constant, dielectric loss, conductor loss, and surface-roughness effects from measured data.
• Use Cadence Allegro Package Designer, Keysight ADS, and Ansys HFSS to design and simulate characterization structures.
• Correlate circuit and electromagnetic simulations with measured S-parameter data.
• Use cross sections and other internal physical analyses to confirm fabricated dimensions and material characteristics.
• Determine appropriate electromagnetic modeling techniques for the observed physical characteristics.
• Develop characterization structures and extraction methods for SMT components and their mounting structures.
• Document characterization methods, extraction procedures, results, and modeling recommendations.
• Present technical findings and recommendations to RF, EM, module, and modeling teams.

Required Experience and Skills

• Currently enrolled in a master’s or Ph.D. program in Electrical Engineering.
• Academic specialization or research experience in electromagnetics, RF engineering, or microwave engineering.
• Strong understanding of electromagnetic theory, transmission lines, microwave networks, and S-parameters.
• Understanding of dielectric and conductor loss mechanisms at RF and microwave frequencies.
• Experience with electromagnetic simulation tools such as Ansys HFSS or similar software.
• Familiarity with RF measurements, calibration, reference planes, and de-embedding.
• Strong analytical and problem-solving skills.
• Ability to analyze measured and simulated data and draw technically supported conclusions.
• Ability to clearly document and present experimental methods and technical results.
• Ability to work full-time in the Ottawa office for a continuous 12-month term.

Desired Experience and Skills

• Experience with RF material characterization or electromagnetic parameter extraction.
• Experience designing transmission-line, resonator, calibration, or de-embedding structures.
• Knowledge of methods for extracting complex dielectric permittivity, dielectric loss, conductor loss, or surface-roughness effects.
• Hands-on experience with RF probes, vector network analyzers, and S-parameter measurements.
• Experience correlating electromagnetic simulations with measured data.
• Experience with Cadence Allegro Package Designer, Keysight ADS, or Ansys HFSS.
• Familiarity with MCM technologies, RF packaging, substrates, vias, transitions, and interconnects.
• Experience designing layouts or test vehicles for fabrication.
• Familiarity with cross-sectional analysis and the use of measured physical dimensions in electromagnetic models.
• Familiarity with SMT components, mounting structures, pads, solder connections, and associated parasitics.
• Experience using Python, MATLAB, or similar tools for measurement processing and parameter extraction.